Commissioned Dicing STB Division
Grinding, CMP, dicing, pellet charging, appearance inspection! We offer a wide range of contract processing services.
We would like to introduce our CMP/Dicing business, "STB Division." We handle a wide range of dicing processes for brittle and hard materials such as glass with a film and ceramics, as well as backside grinding (BG) and polishing (CMP) of silicon wafers, dicing processes (bevel cut, step cut), and chip sorting after wafer processing. We serve as a pipeline between manufacturers that produce semiconductor wafers and those that assemble them. 【Features】 ■ Grinding Process: Back Grinding ■ CMP Process: Polishing ■ Dicing Process: Chip Processing ■ Pellet Charge Process: Chip Transfer Processing ■ Visual Inspection Process *For more details, please refer to the related links page or feel free to contact us.
- Company：北川グレステック 本社
- Price：Other
